Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Patent
1997-04-30
1998-09-15
Kincaid, Kristine L.
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
3613082, 257238, 257772, 257780, H01G 4228
Patent
active
058088539
ABSTRACT:
This invention is directed to a capacitor having a multilevel interconnection technology. At least one solder ball is reflowed and secured onto the capacitor. The solder ball is in electrical communication with the capacitor through a contact. On this reflowed solder ball a cap of low melting point metal is secured. This can be done in a number of ways. The preferred way is to positioning a mask over the solder ball such that a portion of the solder ball is exposed through openings in the mask. At least one layer of a low melting point metal is deposited on the exposed surface of the solder ball through the mask, and thereby forming a capacitor with a multilevel interconnect cap. The low melting point metal can interact with the surface of the solder ball to form a cap of an eutectic or a liquefied portion. The cap portion can then be joined to the object.
REFERENCES:
patent: 3638083 (1972-01-01), Dornfeld et al.
patent: 4967950 (1990-11-01), Legg et al.
patent: 5075965 (1991-12-01), Carey et al.
patent: 5130779 (1992-07-01), Agarwala et al.
patent: 5238176 (1993-08-01), Nishimura
patent: 5251806 (1993-10-01), Agarwala et al.
patent: 5290732 (1994-03-01), Kumar et al.
patent: 5391514 (1995-02-01), Gall et al.
patent: 5451274 (1995-09-01), Gupta
patent: 5470787 (1995-11-01), Greer
patent: 5478420 (1995-12-01), Gauci et al.
patent: 5597469 (1997-01-01), Carey et al.
patent: 5634268 (1997-06-01), Dalal et al.
Dawson, et al., "Indium-Lead-Indium Chip Joining", IBM Technical Disclosure Bulletin, vol. 11, No. 11, Apr. 1969, p. 528.
Microelectronics Packaging Handbook, edited by Rao R. Tummala and Eugene J. Rymaszewski, pp. 366-391 (1989).
Milkovich et al., "Double Sided Flexible Carrier with Discretes and Thermally Enchaned FCA/COF", IEEE 43rd ECTC Proceedings, Jun. 1993, pp. 16-21.
Milkovich et al., U.S. application No. 08/071630, entitled "Manufacturing Flexible Circuit Board Assemblies with Common Heat Spreader", filed on Jun. 3, 1993.
Dalal Hormazdyar M.
Gaudenzi Gene Joseph
Gorrell Rebecca Y.
Takacs Mark A.
Travis, Jr. Kenneth J.
Ahsan Aziz M.
Dinkins Anthony
International Business Machines - Corporation
Kincaid Kristine L.
LandOfFree
Capacitor with multi-level interconnection technology does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Capacitor with multi-level interconnection technology, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Capacitor with multi-level interconnection technology will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-94681