Capacitor placement for integrated circuit packages

Details Capacitor placement for integrated circuit packages Capacitor placement for integrated circuit packages

2007-06-12

2007-06-12

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S678000, C257S724000, C257S778000

Reexamination Certificate

active

10937080

ABSTRACT:
A side-mounted capacitor for a semiconductor die package is described. In one embodiment, a substrate has a die side to which an IC (integrated circuit) may be attached, and an edge adjacent the die side. A bypass capacitor is attached to the package substrate edge.

REFERENCES:
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patent: 2004/0022038 (2004-02-01), Figueroa et al.
patent: 2004/0056341 (2004-03-01), Endo et al.

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