Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2007-11-20
2007-11-20
Fourson, George (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S534000, C257SE27048, C257SE27071, C257SE27092
Reexamination Certificate
active
11024653
ABSTRACT:
A MIM capacitor includes a lower electrode disposed on a semiconductor substrate. A dielectric layer is disposed on the lower electrode to completely cover an exposed surface of the lower electrode. An upper electrode is disposed on the dielectric layer. A method for forming a MIM capacitor includes forming a lower electrode on a semiconductor substrate. A dielectric layer and an upper metal layer are formed on an entire surface of the substrate to cover the lower electrode. The dielectric and upper metal layers are patterned on the lower electrode.
REFERENCES:
patent: 2002/0160565 (2002-10-01), Lee
patent: 2003/0178728 (2003-09-01), Park et al.
patent: 2003/0232497 (2003-12-01), Xi et al.
patent: 2004/0013803 (2004-01-01), Chung et al.
patent: 2004/0108587 (2004-06-01), Chudzik et al.
Dongbu Electronics Co. Ltd.
Fourson George
Garcia Joannie Adelle
Lowe Hauptman & Ham & Berner, LLP
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