Capacitor of semiconductor device and method for forming the...

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor

Reexamination Certificate

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C257S532000, C257SE21350, C257SE29343

Reexamination Certificate

active

07923343

ABSTRACT:
A method for forming a capacitor of a semiconductor device includes forming a cylindrical storage node over a semiconductor substrate; depositing a first dielectric layer over the cylindrical storage node; and etching the first dielectric layer to reduce a thickness of a portion of the first dielectric layer on a protruded end of the cylindrical storage node. The method further includes depositing a second dielectric layer over the etched first dielectric layer, wherein the second dielectric layer supplements a thickness of a portion of the first dielectric layer on a bottom corner of the cylindrical storage node. Finally, a cell plate is formed over the second dielectric layer.

REFERENCES:
patent: 7232735 (2007-06-01), Ohuchi
patent: 2008/0003741 (2008-01-01), Park et al.
patent: 2004-288710 (2004-10-01), None
patent: 2006-156763 (2006-06-01), None
patent: 10-2004-0001866 (2004-01-01), None
patent: 10-2004-0059442 (2004-07-01), None
patent: 10-2006-0017261 (2006-02-01), None
patent: 10-2008-0002912 (2008-01-01), None
patent: 10-2008-0003031 (2008-01-01), None
patent: 10-2008-0038713 (2008-05-01), None

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