Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Reexamination Certificate
2011-04-12
2011-04-12
Garber, Charles D (Department: 2812)
Semiconductor device manufacturing: process
Making passive device
Stacked capacitor
C257S532000, C257SE21350, C257SE29343
Reexamination Certificate
active
07923343
ABSTRACT:
A method for forming a capacitor of a semiconductor device includes forming a cylindrical storage node over a semiconductor substrate; depositing a first dielectric layer over the cylindrical storage node; and etching the first dielectric layer to reduce a thickness of a portion of the first dielectric layer on a protruded end of the cylindrical storage node. The method further includes depositing a second dielectric layer over the etched first dielectric layer, wherein the second dielectric layer supplements a thickness of a portion of the first dielectric layer on a bottom corner of the cylindrical storage node. Finally, a cell plate is formed over the second dielectric layer.
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Garber Charles D
Hynix / Semiconductor Inc.
Isacc Stenetta D
Marshall & Gerstein & Borun LLP
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