Capacitor material with metal component for use in...

Electrical connectors – Including elastomeric or nonmetallic conductive portion – Adapted to be sandwiched between preformed panel circuit...

Reexamination Certificate

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C439S085000, C439S086000

Reexamination Certificate

active

07025607

ABSTRACT:
A material for use as part of an internal capacitor within a circuitized substrate includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ferroelectric ceramic component, the ferroelectric ceramic component nano-particles having a particle size substantially in the range of between about 0.01 microns and about 0.9 microns and a surface within the range of from about 2.0 to about 20 square meters per gram. A circuitized substrate adapted for using such a material and capacitor therein and a method of making such a substrate are also provided. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) are also provided.

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“A New, Thin High-Performance Organic Substrate”, by Donald Banks, Robin Gorrell, Duy Le-Huu, David Hanson and Shichun Qu. Presented Jun. 23, 2004 at the Topical Workshop & Exhibition on Flip Chip Technology. (Sponsor—International Microelectronics and Packaging Society), Austin, Texas.

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