Electrical connectors – Including elastomeric or nonmetallic conductive portion – Adapted to be sandwiched between preformed panel circuit...
Reexamination Certificate
2006-04-11
2006-04-11
Prasad, Chandrika (Department: 2839)
Electrical connectors
Including elastomeric or nonmetallic conductive portion
Adapted to be sandwiched between preformed panel circuit...
C439S085000, C439S086000
Reexamination Certificate
active
07025607
ABSTRACT:
A material for use as part of an internal capacitor within a circuitized substrate includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ferroelectric ceramic component, the ferroelectric ceramic component nano-particles having a particle size substantially in the range of between about 0.01 microns and about 0.9 microns and a surface within the range of from about 2.0 to about 20 square meters per gram. A circuitized substrate adapted for using such a material and capacitor therein and a method of making such a substrate are also provided. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) are also provided.
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“A New, Thin High-Performance Organic Substrate”, by Donald Banks, Robin Gorrell, Duy Le-Huu, David Hanson and Shichun Qu. Presented Jun. 23, 2004 at the Topical Workshop & Exhibition on Flip Chip Technology. (Sponsor—International Microelectronics and Packaging Society), Austin, Texas.
Das Rabindra N.
Lauffer John M.
Markovich Voya R.
Poliks Mark D.
Endicott Interconnect Technologies, Inc.
Fraley Lawrence R.
Hinman, Howard & Kattell LLP
Prasad Chandrika
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