Capacitor material

Details Capacitor material Capacitor material

1980-12-01

1983-06-07

Herbert, Jr., Thomas J.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Physical dimension specified

156247, 156344, 204 13, 204 40, 204 52R, 428336, 428339, 428469, 428931, B32B 1504

Patent

active

043871372

ABSTRACT:
A novel laminate adapted for use in the manufacture of capacitors comprising layers of microthin pin-hole free electroformed copper bonded together by a thin layer of hardened dielectric material, said bonded surfaces of said microthin copper having first been treated to form thereon a superficial coating of cupric oxide, bonded to the outer surfaces of said microthin copper, layers of self-sustaining copper foil, the bonded surfaces of said copper foil having been passivated under reducing or cathodic conditions in an aqueous solution of chromic oxide to passivate the surface thereof and to render said copper foil peelably removable from said microthin copper.
A method of forming capacitor networks which comprises establishing a laminate having layers of microthin pin-hole free electroformed copper bonded together by a thin layer of hardened dielectric material, said bonded surfaces of said microthin copper having first been treated to form thereon a superficial coating of cupric oxide, bonded to the outer surfaces of said microthin copper, layers of self-sustaining copper foil, the bonded surfaces of said copper foil having been passivated under reducing or cathodic conditions in an aqueous solution of chromic oxide to passivate the surface thereof and to render said copper foil peelably removable from said microthin copper,

REFERENCES:
patent: 3998601 (1976-12-01), Yates et al.
patent: 4195124 (1980-03-01), Doi et al.

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