Capacitor in a semiconductor configuration and process for its p

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor

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438738, H01L 2170

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active

059899727

ABSTRACT:
A capacitor in a semiconductor configuration, especially a DRAM, includes an electrode structure having a plurality of spaced-apart elements being electrically connected with a connecting structure and all including p-conductive material with a doping >10.sup.10 cm.sup.-3. The elements of the electrode structure are either stacked or disposed side by side and may be cup-shaped. In a production process, a layer sequence of alternatingly one p.sup.- -doped and one p.sup.+ -doped layer is produced, which receives an opening through the use of anisotropic etching. At least in a peripheral region of the opening, a p.sup.+ -zone is created, which connects the layer sequence and forms the connecting structure. Next, the p.sup.- -doped layers are etched selectively to the p.sup.+ -doped layers, a capacitor dielectric is deposited, and a counterelectrode is produced.

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