Capacitor having upper electrode not formed over device...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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C257S296000, C257S306000

Reexamination Certificate

active

07843034

ABSTRACT:
The semiconductor device comprises a device isolation region14formed in a semiconductor substrate10,a lower electrode16formed in a device region12defined by the device isolation region and formed of an impurity diffused layer, a dielectric film18of a thermal oxide film formed on the lower electrode, an upper electrode20formed on the dielectric film, an insulation layer26formed on the semiconductor substrate, covering the upper electrode, a first conductor plug30aburied in a first contact hole28aformed down to the lower electrode, and a second conductor plug30bburied in a second contact hole28bformed down to the upper electrode, the upper electrode being not formed in the device isolation region. The upper electrode20is not formed in the device isolation region14,whereby the short-circuit between the upper electrode20and the lower electrode16in the cavity can be prevented. Thus, a capacitor of high reliability can be provided.

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Japanese Office Action dated Jun. 16, 2009, issued in corresponding Japanese Application No. 2004-073018.
Japanese Office Action dated Sep. 29, 2009, issued in corresponding Japanese Application No. 2004-073018.

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