Capacitor formed within printed circuit board

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

361312, 361303, 361305, 3613063, 361763, 361760, 361751, H01G 4008, H01G 406

Patent

active

057453349

ABSTRACT:
A multi-layer printed circuit board comprises a first metallic layer, a first Ta or Hf layer on one face of the first metallic layer, a first layer of Ta.sub.2 O.sub.5 or HfO on a face of the Ta or Hf layer opposite the first metallic layer, a second metallic layer on the Ta.sub.2 O.sub.5 or HfO layer opposite the Ta or Hf layer, a first dielectric layer on the first metallic layer opposite the Ta of Hf layer, and a second dielectric layer on the second metallic layer opposite the Ta.sub.2 O.sub.5 or HfO layer. A multi-layer printed circuit board is formed by adding the following layers to form the second capacitor. A third metallic layer on said second dielectric layer, a second Ta or Hf layer on a face of the third metallic layer, a second Ta.sub.2 O.sub.5 or HfO layer on a face of the second Ta or Hf layer opposite the third metallic layer, a fourth metallic layer on the second Ta.sub.2 O.sub.5 or HfO layer opposite the second Ta or Hf layer, and a third dielectric layer on the fourth metallic layer opposite the second Ta.sub.2 O.sub.5 or HfO layer.

REFERENCES:
patent: 3699011 (1972-10-01), Nishimura
patent: 4460938 (1984-07-01), Clei
patent: 4749449 (1988-06-01), Scott
patent: 5027253 (1991-06-01), Lauffer et al.
patent: 5079069 (1992-01-01), Howard et al.
patent: 5161086 (1992-11-01), Howard et al.
patent: 5172304 (1992-12-01), Ozawa et al.
IBM Technical Disclosure Bulletin vol. 22, No. 6, Nov. 1979, "Raw Card Composite Capacitor".
Thin Film Materials Research., Giannelis et al, Nov. 1993.

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