Metal working – Barrier layer or semiconductor device making – Barrier layer device making
Patent
1998-01-28
1999-10-26
Graybill, David
Metal working
Barrier layer or semiconductor device making
Barrier layer device making
427 97, H05K 300, H05K 1300
Patent
active
059720530
ABSTRACT:
A process for manufacturing a multi-layer printed circuit board comprises a first metallic layer, a first Ta or Hf layer on one face of the first metallic layer, a first layer of Ta.sub.2 O.sub.5 or HfO on a face of the Ta or Hf layer opposite the first metallic layer, a second metallic layer on the Ta.sub.2 O.sub.5 or HfO layer opposite the Ta or Hf layer, a first dielectric layer on the first metallic layer opposite the Ta of Hf layer, and a second dielectric layer on the second metallic layer opposite the Ta.sub.2 O.sub.5 or HfO layer. A multi-layer printed circuit board is formed by adding the following layers to form the second capacitor. A third metallic layer on said second dielectric layer, a second Ta or Hf layer on a face of the third metallic layer, a second Ta.sub.2 O.sub.5 or HfO layer on a face of the second Ta or Hf layer opposite the third metallic layer, a fourth metallic layer on the second Ta.sub.2 O.sub.5 or HfO layer opposite the second Ta or Hf layer, and a third dielectric layer on the fourth metallic layer opposite the second Ta.sub.2 O.sub.5 or HfO layer.
REFERENCES:
patent: 3699011 (1972-10-01), Nishimura
patent: 4460938 (1984-07-01), Clei
patent: 4749449 (1988-06-01), Scott
patent: 5027253 (1991-06-01), Lauffer et al.
patent: 5079069 (1992-01-01), Howard et al.
patent: 5161086 (1992-11-01), Howard et al.
patent: 5172304 (1992-12-01), Ozawa et al.
patent: 5264388 (1993-11-01), Yamakawa et al.
patent: 5807626 (1998-09-01), Naba
Thin Film Materials Research., Giannelis et al, Nov. 1993.
IBM Technical Disclosure Bulletin vol. 22, No. 6, Nov. 1979, "Raw Card Composite Capacitor".
Hoffarth Joseph Gerard
Lauffer John Matthew
Mahmoud, deceased Issa Said
Graybill David
International Business Machines - Corporation
Samodovitz Arthur J.
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