Capacitor fabricated on a substrate containing electronic circui

Details Capacitor fabricated on a substrate containing electronic circui Capacitor fabricated on a substrate containing electronic circui

1995-08-15

1996-12-10

Ledynh, Bot L.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361312, H01G 420

Patent

active

055837395

ABSTRACT:
An on-chip decoupling capacitor is disclosed. The capacitor of the present invention is fabricated using an embedded conductive layered structure. A first insulative layer, a first conductive layer, a second insulative layer, a second conductive layer, and a third insulative layer are deposited sequentially on a substrate having electronic circuitry. Next, a patterning layer is formed to provide for vias for interconnection between metal layers above and below the capacitor plates. An etch is then performed to form a via through the first, second and third insulative layers and the first and second conductive layers. Next, a fourth insulative layer is deposited and anisotropically etched to form sidewall insulators on the vias. Finally, interconnection between lower level metal levels and upper level metal levels is made through the vias. Additionally, methods of coupling the upper and lower capacitor plates to either power or ground are described.

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Hartmut Roskos, Martin C. Nuss, Keith W. Goossen, David W. Kisher, Alice E. White, Ken T. Short, Dale C. Jacobson, & John M. Poate, "Propagation of Picosecond Electrical Pulses on a Silicon-Based Microstrip Line With Buried Cobalt Silicide Ground Plane", Appl. Phys. Lett 58(23), 10 Jun. 1991. pp. 2604-2606.

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