Capacitor embedded printed circuit board

Details Capacitor embedded printed circuit board Capacitor embedded printed circuit board

2008-02-12

2011-11-08

Semenenko, Yuriy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

Reexamination Certificate

active

08053673

ABSTRACT:
A capacitor embedded printed circuit board (PCB) includes a multilayer polymer capacitor layer with a plurality of polymer sheets. One or more first inner electrodes and second inner electrodes, separated by one or more of the plurality of polymer sheets, are alternately disposed to form a pair. A plurality of first extended electrodes and second extended electrodes protrude from the first inner electrodes and second inner electrodes, respectively. One or more insulating layers are laminated on one or both surfaces of the multilayer polymer capacitor. A plurality of first via holes for capacitor, and a plurality of second via holes for capacitor, penetrating the multilayer polymer capacitor layer are connected to the first extended electrodes and the second extended electrodes, respectively. The plurality of the first and second extended electrodes are alternately disposed to be opposite to each other.

REFERENCES:
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patent: 7316755 (2008-01-01), Ito et al.
patent: 2006/0032666 (2006-02-01), Kim et al.
patent: 2006/0139849 (2006-06-01), Yoon et al.
patent: 2008/0239685 (2008-10-01), Kawabe et al.
patent: 2008/0273288 (2008-11-01), Horowitz et al.
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patent: 2006-060187 (2006-03-01), None
patent: 2006-278759 (2006-10-01), None
patent: 10-2005-0031400 (2005-04-01), None
patent: 10-2006-0016058 (2006-02-01), None
Korean Office Action with English Translation issued in Korean Patent Application No. 10-2007-0024071, dated Feb. 11, 2008.
Japanese Office Action, with English Translation, issued in Japanese Patent Application No. 2008-038803, dated Apr. 13, 2010.

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