Capacitor, circuit board with built-in capacitor and method...

Details Capacitor, circuit board with built-in capacitor and method... Capacitor, circuit board with built-in capacitor and method...

2007-01-30

2007-01-30

Lebentritt, Michael (Department: 2812)

Metal working

Barrier layer or semiconductor device making

Barrier layer device making

C257SE21479

Reexamination Certificate

active

11031764

ABSTRACT:
In a capacitor10, a first electrode21, a dielectric layer23, a solid electrolytic layer50and a second electrode31are provided. In a manufacturing process, the dielectric layer23and a first solid electrolytic layer24formed by a chemical polymerization film are provided on the first electrode21side, while a second solid electrolytic layer32formed by an electrolytic polymerization film is provided on the second electrode31side. Then, the solid electrolytic layers are bonded to each other.

REFERENCES:
patent: 3631306 (1971-12-01), Hitchcock
patent: 3936545 (1976-02-01), Brill et al.
patent: 5005107 (1991-04-01), Kobashi et al.
patent: 6068782 (2000-05-01), Brandt et al.
patent: 6426866 (2002-07-01), Shoji et al.
patent: 64-32621 (1989-02-01), None
patent: 05283300 (1993-10-01), None

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