Capacitor below the buried oxide of SOI CMOS technologies...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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Details

C257S528000, C257S296000, C257S297000, C257S300000

Reexamination Certificate

active

07315075

ABSTRACT:
Disclosed is a semiconductor structure that incorporates a capacitor for reducing the soft error rate of a device within the structure. The multi-layer semiconductor structure includes an insulator-filled deep trench isolation structure that is formed through an active silicon layer, a first insulator layer, and a first bulk layer and extends to a second insulator layer. The resulting isolated portion of the first bulk layer defines the first capacitor plate. A portion of the second insulator layer that is adjacent the first capacitor plate functions as the capacitor dielectric. Either the silicon substrate or a portion of a second bulk layer that is isolated by a third insulator layer and another deep trench isolation structure can function as the second capacitor plate. A first capacitor contact couples, either directly or via a wire array, the first capacitor plate to a circuit node of the device in order to increase the critical charge, Qcrit, of the circuit node.

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patent: 6225664 (2001-05-01), Endo et al.
patent: 6337253 (2002-01-01), Davari et al.
patent: 6794901 (2004-09-01), Bernstein et al.
patent: 2001/0040467 (2001-11-01), Kumar et al.
patent: 2002/0185684 (2002-12-01), Campbell et al.
patent: 2003/0094654 (2003-05-01), Christensen et al.
patent: 2003/0199128 (2003-10-01), Furukawa
patent: 2003/0234430 (2003-12-01), Friend et al.
patent: 2004/0041208 (2004-03-01), Bhattacharyya
patent: 2004/0216015 (2004-10-01), Bernstein et al.

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