Electrical audio signal processing systems and devices – Electro-acoustic audio transducer – Microphone capsule only
Reexamination Certificate
2011-03-15
2011-03-15
Ni, Suhan (Department: 2614)
Electrical audio signal processing systems and devices
Electro-acoustic audio transducer
Microphone capsule only
C381S175000
Reexamination Certificate
active
07907744
ABSTRACT:
A vibration electrode plate112is formed on the upper face of a silicon substrate32with an insulating coat film35interposed in between. An opposing electrode plate113is placed on the vibration electrode plate112with an insulating coat film interposed in between, and acoustic holes40are opened through the opposing electrode plate113. Etching holes36and104, each having a semi-elliptical shape, are opened through the vibration electrode plate112and the opposing electrode plate113so as to face each other longitudinally. A concave section37having a truncated pyramid shape is formed in the upper face of the silicon substrate32, by carrying out an etching process through the etching holes36and104. The vibration electrode plate112is held in the silicon substrate32by a holding portion112placed between the etching holes36.
REFERENCES:
patent: 4456796 (1984-06-01), Nakagawa et al.
patent: 4776019 (1988-10-01), Miyatake et al.
patent: 5146435 (1992-09-01), Bernstein
patent: 5303210 (1994-04-01), Bernstein
patent: 6088463 (2000-07-01), Rombach et al.
patent: 6178249 (2001-01-01), Hietanen et al.
patent: 7031480 (2006-04-01), Himori et al.
patent: 7221767 (2007-05-01), Mullenborn et al.
patent: 62-284233 (1987-12-01), None
patent: 04-127479 (1992-04-01), None
patent: 09-082983 (1997-03-01), None
patent: 09-130199 (1997-05-01), None
patent: 09-508777 (1997-09-01), None
patent: 2001-013156 (2001-01-01), None
patent: 2001-518246 (2001-10-01), None
patent: 2002-027595 (2002-01-01), None
patent: 2003-508998 (2003-03-01), None
patent: 2004-506394 (2004-02-01), None
patent: 2004-128957 (2004-04-01), None
patent: WO-96/05711 (1996-02-01), None
patent: WO-98/37388 (1998-08-01), None
patent: WO-01/19134 (2001-03-01), None
patent: WO-02/15636 (2002-02-01), None
International Search Report issued in PCT/JP2005/019893 mailed on Feb. 7, 2006 with translation, 4 pages.
Imamoto Hiroshi
Kasai Takashi
Kato Fumihito
Munechika Masaki
Sato Fumihiko
Ni Suhan
Omron Corporation
Osha • Liang LLP
LandOfFree
Capacitive vibration sensor and method for manufacturing same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Capacitive vibration sensor and method for manufacturing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Capacitive vibration sensor and method for manufacturing same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2633758