Capacitive semiconductor sensor

Details Capacitive semiconductor sensor Capacitive semiconductor sensor

2007-09-11

2007-09-11

Purvis, Sue A. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S778000, C257S686000, C257SE25013

Reexamination Certificate

active

10792734

ABSTRACT:
In a capacitive semiconductor sensor, a sensor chip and a circuit chip are contained in a package. First bump members are mounted on second electrodes disposed on a second surface of the circuit chip, respectively. The sensor chip is mounted at its first surface on the second surface of the circuit chip so that first electrodes disposed on the first surface of the sensor chip are electrically mechanically connected to the second electrodes through the first bump members, respectively. Second bump members are mounted on third electrodes disposed on the second surface of the circuit chip, respectively. The third electrodes are electrically mechanically connected to lead electrodes disposed to the package through the second bump members, respectively.

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Notification of Reasons for Rejection from Japanese Patent Office issued on Jul. 4, 2006 for the corresponding Japanese patent application No. 2002-061564 (a copy and English translation thereof).
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