Capacitive semiconductor pressure sensor

Measuring and testing – Fluid pressure gauge – Diaphragm

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Details

73718, 3612834, 257419, G01L 912

Patent

active

056314280

ABSTRACT:
A micromechanically manufacturable pressure sensor has a cavity produced in an auxiliary layer that is covered with a membrane layer, the cavity is produced via recesses in the membrane layer. These recesses are subsequently closed by portions of a closure layer. Further layers can be applied on the closure layer. Portions of the further layers and closure layer are removed above the membrane layer.

REFERENCES:
patent: 4332000 (1982-05-01), Petersen
patent: 4665610 (1987-05-01), Barth
patent: 5095401 (1992-03-01), Zavracky

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