Capacitive PCB with internal capacitive laminate

Details Capacitive PCB with internal capacitive laminate Capacitive PCB with internal capacitive laminate

1997-06-23

1999-02-09

Kincaid, Kristine

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361313, 361763, 361312, H01G 406, H01G 420, N32B 900

Patent

active

058702741

ABSTRACT:
An in situ method for forming a bypass capacitor element internally within a PCB including the steps of arranging one or more uncured dielectric sheets with conductive foils on opposite sides thereof and laminating the conductive foils to the dielectric sheet simultaneously as the PCB is formed by a final lamination step, the conductive foils preferably being laminated to another layer of the PCB prior to their arrangement adjacent the dielectric sheet or sheets, the dielectric foils even more preferably being initially laminated to additional dielectric sheets in order to form multiple bypass capacitive elements as a compound subassembly within the PCB. A number of different dielectric materials and resins are disclosed for forming the capacitor element. A dielectric component in the capacitor element preferably includes dielectric material and thermally responsive material, the thermally responsive material either forming a carrier for the dielectric material or formed as two separate sheets on opposite sides of a sheet of the dielectric material.

REFERENCES:
patent: 5079069 (1992-01-01), Howard et al.

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