Boots – shoes – and leggings
Patent
1988-10-13
1991-01-01
Ruggiero, Joseph
Boots, shoes, and leggings
324 61P, 31856816, 364183, 364481, 364513, 901 9, 901 35, 901 45, 901 46, G06F 1546
Patent
active
049823337
ABSTRACT:
There are disclosed methods and apparatuses for the assembling of parts using capacitive sensing, both for controlling the closure or "homing" phase of the assembly process and for acquiring one or more of the parts prior to that phase. Assembling of semiconductor parts to essentially two-dimensional and three-dimensional packages, the insertion of a peg in a hole, and an application to tape-automated-bonding (TAB) technology are all described, as are various representations of the resulting capacitive data. Included are the uses of scheduling and optical sensing to supplement capacitive sensing in the methods and apparatuses.
REFERENCES:
patent: 4481616 (1984-11-01), Matey
patent: 4485453 (1984-11-01), Taylor
patent: 4557386 (1985-12-01), Buckley et al.
patent: 4850631 (1989-07-01), Dotsko
Cho et al.-"Robotic Assembly: A Synthesizing Overview", Robotica (1987), vol. 5, pp. 153-165.
G. Boothroyd, Corrando Poli and Laurence E. Murch, Automatic Assembly, Marcel Dekker, New York, (1982).
Benjamin C. Kuo, Automatic Control Systems, third edition, Prentice Hall, (1975), pp. 1-15.
A. M. Thompson, The Precise Measurement of Small Capacitances, IRE Transactions on Instrumentations, vol. 1-7, pp. 245-253; Dec. 1958.
R. V. Jones and J. S. C. Richards, The Design and Application of Capacitance Micrometers, Journal of Physics E, Science Instruments, vol. Series 2, 1973, pp. 589-600.
F. W. Sinden and R. A. Boie, A Planar Capacitive Force Sensor with Six Degrees of Freedom, IEEE Intern. Conf. on Robotics and Automation, San Francisco, CA, 1986, pp. 1806-1814.
G. L. Miller, D. V. Lang and L. C. Kimerling, Capacitance Transient Spectroscopy, Ann. Rev. Material Sci., 7:377-448 (1977).
Peter S. Maybeck, Stochastic Models, Estimation and Control, vol. 1, Academic Press, 1979.
Paul Hoffman, TAB Implementation and Trends, Solid State Technology, Jun. 1988.
Ackerman David A.
Boie Robert A.
AT&T Bell Laboratories
Landis Martin S.
Ruggiero Joseph
Wisner W. L.
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