Capacitance guided assembly of parts

Boots – shoes – and leggings

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324 61P, 31856816, 364183, 364481, 364513, 901 9, 901 35, 901 45, 901 46, G06F 1546

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active

049823337

ABSTRACT:
There are disclosed methods and apparatuses for the assembling of parts using capacitive sensing, both for controlling the closure or "homing" phase of the assembly process and for acquiring one or more of the parts prior to that phase. Assembling of semiconductor parts to essentially two-dimensional and three-dimensional packages, the insertion of a peg in a hole, and an application to tape-automated-bonding (TAB) technology are all described, as are various representations of the resulting capacitive data. Included are the uses of scheduling and optical sensing to supplement capacitive sensing in the methods and apparatuses.

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