Capacitance forming method

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364488, G06F 1750

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active

057345830

ABSTRACT:
A capacitance forming method for forming capacitances corresponding to a plurality of constant numbers within a large scale integrated circuit (LSI) comprises steps of defining a unit capacitance with a predetermined shape, defining an arrangement of a plurality of the unit capacitances of a number necessary for total capacity of capacitances to be formed in two dimension in an area of the LSI, selecting the unit capacitances of a number corresponding to the maximal capacity among capacities of the capacitances to be formed so that the selected unit capacitances are equivalently dispersed over the area, and successively selecting other of the capacitances than the capacitance of the maximal capacity in the order of capacities, and selecting the unit capacitances of a number corresponding to a capacity of each the capacitance selected so that the selected unit capacitances are equivalently dispersed over an area of the rest of the unit capacitances which have not selected yet.

REFERENCES:
patent: 4694403 (1987-09-01), Nomura
patent: 5212653 (1993-05-01), Tanaka
patent: 5245543 (1993-09-01), Smayling et al.
patent: 5278105 (1994-01-01), Eden et al.
patent: 5313090 (1994-05-01), Monikawa
patent: 5459093 (1995-10-01), Kuroda et al.
patent: 5471090 (1995-11-01), Deutch et al.
Kaneko et al., "A Novel Capacitor Placement Strategy in ASCCOT:Automatic Layouter for Switched Capacitor Circuits, " 1993 IEEE Int'l Symp. on Circuits and Systems, pp. 2094-2097.
Singh et al., "A Fast and Area-Efficiency BWC Array D/A and A/D Conversion Scheme", IEEE Transations on Circuits and Systems, No. 6, Jun. 1989, pp. 912-916.
"Design and Application for SC Circuit Networks", pp. 168-170, Nov. 25, 1985 published by Tokai Daigaku Shuppankai.
Takai, Tokumichi "Semiconductor Circuit Designing Technology", Mikkei BP Sha, 1993, pp. 54-60.

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