Capacitance electronic disc molding compositions

Compositions – Electrically conductive or emissive compositions – Elemental carbon containing

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252510, 524296, 369286, 369276, 346137, H01B 106

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active

045227470

ABSTRACT:
An improved conductive molding composition for the preparation of high density capacitance electronic discs is disclosed. The disclosed compositions are improved by the utilization of a solid plasticizer, cumylphenyl isophthalate, represented by the formula ##STR1## The use of this plasticizer permits the formulation of a conductive molding composition wherein all ingredients are solids.

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