Cap providing flat surface for DCA and solder ball attach and fo

Details Cap providing flat surface for DCA and solder ball attach and fo Cap providing flat surface for DCA and solder ball attach and fo

1996-03-20

1998-03-31

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174255, 174262, 174261, 257738, 361777, 361792, H01R 900

Patent

active

057345600

ABSTRACT:
A cap for attaching a chip or other device to a multi-layer electronic structure. The cap includes a plurality of pads of an electrically-conducting material attached over plated through holes of the multi-layer electronic structure. Each of the pads includes a flat upper surface for attaching the chip or other device to the multi-layer structure, provides an electrical connection between the chip or other device and the multi-layer structure, and seals the through holes to prevent solder from entering the plated through hole. The pads are physically isolated from each other.

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IBM Technical Disclosure Bulletin, vol. 34, No. 12, 1 May 1992, pp. 85-86 XP000308436 "Via Rich Thin Film Wiring Scheme for Electronic Packaging".
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