Cantilever spring and method for temporarily coupling a semicond

Details Cantilever spring and method for temporarily coupling a semicond Cantilever spring and method for temporarily coupling a semicond

1994-03-15

1996-02-27

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 68, H01R 909

Patent

active

054944481

ABSTRACT:
A cantilever spring (16) and a method for temporarily coupling a semiconductor package (36) to a transmission line (14) by means of the cantilever spring (16). The cantilever (16) has first and second pressure points (22, 32) that contact the transmission line (14). A force is applied to a third pressure point (32) which moves the first and second pressure points in opposite directions along the transmission line (14). In addition, the force on the third pressure point moves an end (21) of the cantilever spring (16) in a direction away from the transmission line (14). A lead (37) from the semiconductor package (36) contacts a portion of the end (21). Electrical signals are transmitted between the semiconductor package (36) and a tester via the cantilever spring (16) and the transmission line (14), wherein the electrical signals are for testing a semiconductor device (30).

REFERENCES:
patent: 4359252 (1982-11-01), Olsson et al.
patent: 4553192 (1985-11-01), Babuka et al.
patent: 4688870 (1987-08-01), Egawa et al.
patent: 4872850 (1989-10-01), Mogi et al.
patent: 4956604 (1990-09-01), Cedrone
patent: 5067904 (1991-11-01), Takeuchi et al.
patent: 5069629 (1991-12-01), Johnson
patent: 5177436 (1993-01-01), Lee
patent: 5252079 (1993-10-01), Grabbe
Motorola ECLinPS Data Book, 1991, pp. 4-8-4-28.

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