Etching a substrate: processes – Forming or treating an article whose final configuration has...
Patent
1996-05-14
1998-09-22
Breneman, R. Bruce
Etching a substrate: processes
Forming or treating an article whose final configuration has...
437228, 250306, 250307, H01L 21306
Patent
active
058110178
ABSTRACT:
A composite silicon-on-insulator substrate comprises first and second substrates and an oxide film interposed between them. The second substrate is partially removed, such that a lever-base section is formed. An oxide film is formed on the sides of the lever-base section. The second substrate has its thickness set to a predetermined value by wet anisotropic etching, such that a pre-lever section is formed and such that a probe-base section is formed at one end of the pre-lever section. An oxide film is formed on the pre-lever section and the probe-base section, such that a lever section with a desired thickness and a probe section with a sharpened tip are formed. A part of the first substrate is etched away, such that a support section is formed. The oxide film covering the lever section and the probe section is removed.
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Catalog Sheet for OMCL Series Micro Cantilever, by Olympus Optical Co., Ltd., Tokyo, Japan, published at least as early as Mar. 30, 1995.
Catalog Sheet for OMCL Series Micro Cantilever, containing English language materials on p. 2 thereof, by Olympus Optical Co., Ltd., Tokyo, Japan, (published after Mar. 30, 1995 and before May 14, 1996).
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Catalog Sheet for OMCL Series Micro Cantilever, by Olympus Optical Co., Ltd., Tokyo, Japan.
Oyo Buturi vol. 64, No. 3, 1995, Tokyo, Japan, page including advertisement for OMCL Series Micro Cantilever made by Olympus Optical Co., Ltd., Tokyo, Japan.
Breneman R. Bruce
Olympus Optical Co,. Ltd.
Weingart Thomas
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