Can-type evaporative cooling device for power semiconductor elem

Details Can-type evaporative cooling device for power semiconductor elem Can-type evaporative cooling device for power semiconductor elem

1984-03-05

1986-03-11

Davis, Jr., Albert W.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

16510421, 357 82, 361385, H01L 2346

Patent

active

045748772

ABSTRACT:
In the disclosed can-type evaporative cooling device for power semiconductor elements, the semiconductor elements (1) are stacked, in disk cell construction, alternately with cooling cans (2) to form a column having a conjoint clamping device (10). The cooling cans (2) have evaporator cavities for receiving an electrically insulating cooling liquid which evaporates when the semiconductor elements (1) are in operation. A closed coolant circuit between the cooling cans (2) and a conjoint recooler, via pipelines, results. For electrical separation of the electrically live cooling cans (2) from one another and from the recooler, electrically insulating horizontal vapor collecting lines (20) and condensate collecting lines (21) are provided to each of which are connected vertical vapor lines (7) and condensate lines (23), respectively, for the individual cooling cans (2). The condensate lines (21, 23) are each accommodated in the corresponding vapor lines (7, 20). Preferably, a cast polyamide is used as the material for the vapor collecting lines (20). Significant figure: FIG. 1

REFERENCES:
patent: 3989099 (1976-11-01), Hosono et al.

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