Camera module package

Details Camera module package Camera module package

2006-11-30

2010-02-16

Perkey, W. B. (Department: 2862)

Photography

Camera detail

Having printed circuit detail

C396S529000, C396S541000, C348S340000, C348S374000

Reexamination Certificate

active

07664390

ABSTRACT:
A camera module package comprises a housing having a lens section mounted therein; a circuit board having a window through which light transmitted through the lens section of the housing passes; an image sensor that is flip-chip bonded to a lower surface of the circuit board; and an impact absorbing member attached to an upper surface of the circuit board, of which the side surface serves as a coupling guide which is coupled to an inner periphery of the housing.

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Japanese Office Action issued on Apr. 7, 2009 in corresponding Japanese Patent Application 2006-318341.

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