Camera module for compact electronic equipments

Details Camera module for compact electronic equipments Camera module for compact electronic equipments

2007-10-16

2007-10-16

Pyo, Kevin (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Photocell controlled circuit

C250S208100, C438S106000, C257S692000

Reexamination Certificate

active

11710500

ABSTRACT:
In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.

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