Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2011-03-08
2011-03-08
Geyer, Scott B (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C438S065000, C438S116000
Reexamination Certificate
active
07901972
ABSTRACT:
Provided is a method of manufacturing a camera module, the camera module including a housing that includes one or more lenses which are sequentially fixed and coupled and of which the focus does not need to be adjusted; a holder assembly that is coupled to a lower end portion of the housing; and a main substrate that is coupled to a lower end portion of the holder assembly. The method comprises providing bonding media for bonding the main substrate through a reflow process such that the bonding media are disposed on a lower surface of a holder substrate composing the lower end portion of the holder assembly, and fixing an image sensor on an upper surface of the holder substrate through wire bonding; mounting a holder formed of a ceramic material so as to surround the image sensor wire-bonded to the holder substrate; mounting an IR filter on the holder so as to seal an internal space of the holder, which is defined by the holder substrate and the holder and in which the image sensor is included, thereby completely manufacturing the holder assembly; bonding the holder assembly to the main substrate through a reflow process; and performing fine focus adjustment while sliding the housing into the housing mounting portion formed at the upper end portion of the holder body coupled to the main substrate.
REFERENCES:
patent: 7199359 (2007-04-01), Webster
patent: 2006/0006486 (2006-01-01), Seo et al.
patent: 2007-264116 (2007-10-01), None
patent: 10-2007-0093168 (2007-09-01), None
Geyer Scott B
Samsung Electro-Mechanics Co. Ltd.
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