Camera module and method of manufacturing the same

Photography – Having photocell at specific position within camera

Reexamination Certificate

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C396S439000

Reexamination Certificate

active

07925154

ABSTRACT:
Provided is a camera module including an image sensor module including a substrate; an image sensor that is mounted on a top surface of the substrate; a ground pad that is disposed on a bottom surface of the substrate; and a sealing member that seals the image sensor mounted on the substrate; a lens member that is stacked on the image sensor module; and a conductive member that is formed on side surfaces of the image sensor module and the lens member so as to be electrically connected to the ground pad.

REFERENCES:
patent: 7439094 (2008-10-01), Song et al.
patent: 7515817 (2009-04-01), Shiraishi et al.
patent: 7614807 (2009-11-01), Jao
patent: 7651878 (2010-01-01), Ryu
patent: 7663083 (2010-02-01), Kwon et al.
patent: 2008/0164550 (2008-07-01), Chen et al.
patent: 10-2006-0088189 (2006-08-01), None

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