Camera module

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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Details

C257S431000

Reexamination Certificate

active

06882020

ABSTRACT:
A small, thin camera module is provided in which a chipset made up of the image pickup element (13), etc., is sealed with the transparent resin (15) wherein a camera module (10) is made up of a conductive pattern (11); a signal processing element (12) having a surface on which an element is formed and which is shielded from light by being mounted facedown on the conductive pattern (11); an image pickup element (13) fixed onto the signal processing element (12); a thin metal wire (16) by which an electrical connection is established between the image pickup element (13) and the conductive pattern (11); a transparent resin (15) with which the signal processing element (12), the image pickup element (13), and the thin metal wire (16) are covered; and a lens (24) situated above the image pickup element (13).

REFERENCES:
patent: 6297540 (2001-10-01), Assadi et al.

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