Photography – Camera detail – Having printed circuit detail
Reexamination Certificate
1998-11-24
2001-10-30
Gray, David M. (Department: 2851)
Photography
Camera detail
Having printed circuit detail
C257S778000
Reexamination Certificate
active
06311023
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a camera and, more particularly, to a camera comprising a flexible printed board on which a semiconductor element is flip-chip-bonded.
2. Description of the Related Art
In a conventional compact device such as a camera, a flexible printed board is frequently employed to arrange various electric circuits in a compact housing. A technical means for bonding an element such as an IC by a so-called flip chip bonding method is also known.
This flip chip bonding method is a bonding method for arranging an element such as an IC on a printed board upside down. According to this method, an external electrode on the IC is subjected to a bump (projection) process to directly connect the external electrode to the pattern of the board or to connect the external electrode to the pattern through conductive particles. As a concrete example of the flip chip bonding method, a bonding method is disclosed in Japanese Examined Patent Publication No. 62-6652, Japanese Unexamined Patent Publication No. 7-211423, and the like.
A general flexible printed board is formed such that a copper foil is interposed between sheets each having a thickness of several tens Fm. Since the sheet consists of an almost transparent material such as polyimide or polyester, the flexible printed board is considerably inferior to a hard printed board in light-shielding property.
When a semiconductor element such as an IC is bonded on a flexible printed board being inferior in light-shielding property by the flip chip bonding method, the following drawbacks occur. More specifically, when such a flexible printed board is applied to a product such as a camera which is used under outside strong light or a product used to guide object light to the inside of the product, sunlight, illumination light, or leakage light from a built-in electronic flash, a date LED, or the like is incident on the surface of the semiconductor element such as an IC because the flexible printed board itself is inferior in light-shielding property as described above. As a result, in the semiconductor element, a change in performance or an erroneous operation is disadvantageously caused by a photo-electric effect.
SUMMARY OF THE INVENTION
It is a first object of the present invention to provide a camera in which, even if the camera comprises a flexible printed board on which a semiconductor element is flip-chip-bonded, the surface of the semiconductor element is shielded from external light or the like.
It is a second object of the present invention to provide a camera in which a change in performance, an erroneous operation, or the like caused by the photo-electric effect of an element on an internal semiconductor can be easily prevented.
In short, a camera according to the present invention has a flexible printed board on which a semiconductor element is flip-chip-bonded and a light-shieldable member such as a housing, a lens barrel, and an outer member, wherein an element formation surface for the semiconductor element flip-chip-bonded on the flexible printed board is arranged opposite the light-shieldable member.
These as well as other objects and advantages of the present invention will become further apparent from the following detailed explanation.
REFERENCES:
patent: 5508781 (1996-04-01), Imai et al.
patent: 5592255 (1997-01-01), Wakabayashi et al.
patent: 5708865 (1998-01-01), Soshi et al.
patent: 5752119 (1998-05-01), Miyamoto et al.
patent: 60-180132 (1985-09-01), None
patent: 7-211423 (1995-08-01), None
Gray David M.
Olympus Optical Co,. Ltd.
Volpe and Koenig P.C.
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