Measuring and testing – Instrument proving or calibrating – Roughness or hardness
Patent
1997-08-07
1999-09-21
Larkin, Daniel S.
Measuring and testing
Instrument proving or calibrating
Roughness or hardness
73105, G01B 528
Patent
active
059556544
ABSTRACT:
A metrology standard that is useful for calibrating instruments for the levels of microroughness encountered in semiconductor, disk drive, and related industries today. In advanced applications, this level is about 5 .ANG. rms in a 0.01-1.0 .mu.m.sup.-1 spatial bandwidth range. This standard uses a one-dimensional square wave pattern etched in a silicon wafer to reduce the effects of instrument spatial bandwidth. The standard has approximately a 20 .mu.m pitch with feature depths as small as 8 .ANG..
REFERENCES:
patent: 5599464 (1997-02-01), Laird et al.
W. Murray Bullis, "Microroughness of Silicon Wafers", paper presented at Electrochemical Society Silicon Symposium, San Francisco, California, pp. 1156-1169 (May 1994).
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B. W. Scheer, "Developing a haze and a microroughness reference standard", Micro(Jun. 1996).
J. C. Stover, "Roughness characterization of smooth machined surfaces by light scattering", Applied Optics, vol. 14, No. 8, pp. 1796-1802 (Aug. 1975).
E. L. Church et al., "The Prediction of BRDFs from surface profile measurements", Proc. SPIE1165, pp. 136-150 (Aug. 1989).
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Scheer Bradley W.
Stover John C.
Larkin Daniel S.
Protsik Mark
Schneck Thomas
VLSI Standards, Inc.
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