Calibration of thermal sensors for semiconductor dies

Details Calibration of thermal sensors for semiconductor dies Calibration of thermal sensors for semiconductor dies

2008-04-08

2008-04-08

Pert, Evan (Department: 2826)

Data processing: measuring, calibrating, or testing

Calibration or correction system

Temperature

C702S130000, C702S132000, C374S001000, C374S141000, C374S152000, C365S212000, C327S378000, C327S512000

Reexamination Certificate

active

10955154

ABSTRACT:
A thermal management system is described which may be implemented on a semiconductor die. The system may include a thermal sensor thermally coupled to the die to sense the temperature of the die and generate an output representing the sensed temperature, and an adjustable compensation circuit coupled to the thermal sensor to compensate the thermal sensor output. The adjustable compensation circuit may be applied to the thermal sensor or to a threshold.

REFERENCES:
patent: 5798667 (1998-08-01), Herbert
patent: 6779736 (2004-08-01), Lorenz
patent: 6837441 (2005-01-01), Lorenz
patent: 6924758 (2005-08-01), Lorenz
patent: 6974252 (2005-12-01), Bowden et al.
patent: 7145823 (2006-12-01), Jain et al.
patent: 2004/0003301 (2004-01-01), Nguyen
patent: 2004/0128101 (2004-07-01), Hermerding, II
patent: 2004/0179576 (2004-09-01), Bowden et al.
patent: 2005/0261866 (2005-11-01), Boerstler et al.
patent: 2006/0029122 (2006-02-01), Bowden et al.

Affiliated with

Also associated with

Rating

Calibration of thermal sensors for semiconductor dies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Calibration of thermal sensors for semiconductor dies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Calibration of thermal sensors for semiconductor dies will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3942604