Calibration of thermal sensors for semiconductor dies

Details Calibration of thermal sensors for semiconductor dies Calibration of thermal sensors for semiconductor dies

2008-04-08

2008-04-08

Pert, Evan (Department: 2826)

Data processing: measuring, calibrating, or testing

Calibration or correction system

Temperature

C702S130000, C702S132000, C374S001000, C374S141000, C374S152000, C365S212000, C327S378000, C327S512000

Reexamination Certificate

active

07356426

ABSTRACT:
A thermal management system is described which may be implemented on a semiconductor die. The system may include a thermal sensor thermally coupled to the die to sense the temperature of the die and generate an output representing the sensed temperature, and an adjustable compensation circuit coupled to the thermal sensor to compensate the thermal sensor output. The adjustable compensation circuit may be applied to the thermal sensor or to a threshold.

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