Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2006-11-21
2009-10-06
Nguyen, Sang (Department: 2886)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
C356S237400, C356S394000, C702S085000, C703S002000
Reexamination Certificate
active
07599051
ABSTRACT:
A method for calibration of a substrate inspection tool is disclosed. The tool is used to inspect a standard substrate having simulated contamination defects with known characteristics. Performance of the tool in detecting the simulated contamination defects is determined. The tool exposes the standard substrate and simulated contamination defects to radiation having a wavelength of about 260 nanometers or less. The simulated contamination defects are stable over time under exposure to radiation having a wavelength of about 260 nanometers or less.
REFERENCES:
patent: 4636073 (1987-01-01), Williams
patent: 5164794 (1992-11-01), Markle
patent: 5362591 (1994-11-01), Imai et al.
patent: 5383018 (1995-01-01), Sadjadi
patent: 5453830 (1995-09-01), Greed, Jr.
patent: 5886909 (1999-03-01), Milor et al.
patent: 6327555 (2001-12-01), Shimizu et al.
patent: 6509564 (2003-01-01), Suzuki et al.
patent: 6654698 (2003-11-01), Nulman
patent: 7426031 (2008-09-01), Kim et al.
F1620-96 “Standard Practice for Calibrating a Scanning Surface Inspection System Using Monodisperse Polystyrene Latex Spheres Deposited on Polished or Epitaxial Wafer Surface” (Withdrawn Standard 2003), ASTM International, 2003.
George W. Mulholland et al., “Modeling, Measurement, and Standards for Wafer Inspection”, published in proceedings of theGovernment Microcircuits Applications and Critical Technologies(GOMACTech)Conference: “Countering Asymmetric Threats”, held Mar. 31 to Apr. 3, 2003 in Tampa, Florida.
William H. Broadbent et al., “Results from a New Reticle Defect Inspection Platform”,23rdAnnual BACUS Symposium on Photomask Technology, Proceeding of SPIE, vol. 5256, pp. 474-488 (2003).
Stan Stokowski et al., “Wafer Inspection Technology Challenges for ULSI Manufacturing—Part I”, Spring 1999, Yield Management Solutions, pp. 28-32.
Labovitz Steven M.
Sousa Weston L.
Isenberg Joshua D.
JDI Patent
KLA-Tencor Technologies Corporation
Nguyen Sang
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