Calibration apparatus for bondhead of wire bonding machine

Details Calibration apparatus for bondhead of wire bonding machine Calibration apparatus for bondhead of wire bonding machine

2008-09-29

2009-12-01

Ward, Jessica L. (Department: 1793)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S105000, C228S180500

Reexamination Certificate

active

07624904

ABSTRACT:
A wire bonding machine including a bondhead assembly having a transducer and a bonding tool is provided. The bondhead assembly is configured for substantially vertical movement with respect to a bonding surface of the wire bonding machine during a wire bonding operation. The wire bonding machine further includes a camera configured to receive images of a portion of the bondhead assembly, the images being used to determine a position where a length of the transducer is substantially parallel to the bonding surface.

REFERENCES:
patent: 5927587 (1999-07-01), Koduri
patent: 6112972 (2000-09-01), Koduri
patent: 6176414 (2001-01-01), Sadler
patent: 6412683 (2002-07-01), Beatson et al.
patent: 7377415 (2008-05-01), Frasch et al.

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