Cable direct interconnection (CDI) method for phased array...

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

Reexamination Certificate

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C310S326000

Reexamination Certificate

active

07569975

ABSTRACT:
A solderless, direct cable interconnect for an array transducer and method for the fabrication thereof. An ultrasonic array transducer includes an acoustic backing layer, a piezoelectric layer containing an array of piezoelectric elements (typically created from a solid layer of piezoelectric material disposed over a matching layer cut with a dicing saw and fixed on a solid ground plane), and plurality of control wires, disposed between the backing layer and the piezoelectric layer. A solid backing material which will displace slightly at temperature and pressure is formed into the desired shape. Kerfs are precisely cut into the shaped backing material in a pattern such that they will line up with the center of each piezoelectric element in the piezoelectric layer. Signal wires are disposed across the backing material along the kerfs, and the piezoelectric layer is aligned and then compression bonded to the backing layer, encapsulating the signal wires and electrically connecting them to the piezoelectric elements without the need for an intermediate connection board or flex circuit.

REFERENCES:
patent: 5648942 (1997-07-01), Kunkel, III
patent: 6894425 (2005-05-01), Solomon et al.
patent: 2005/0020918 (2005-01-01), Wilk et al.
patent: 2006/0132123 (2006-06-01), Wang et al.
patent: 2006/0229594 (2006-10-01), Francischelli et al.
Search Report issued by PCT Office on Feb. 8, 2008 in connection with corresponding application No. PCT/US 06/46794.
Written Opinion issued by PCT Office on May 22, 2009 in connection with corresponding application No. PCT/US2006/o46794.

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