Semiconductor device manufacturing: process – Including control responsive to sensed condition – Interconnecting plural devices on semiconductor substrate
Patent
1996-02-28
1998-07-07
Bowers, Jr., Charles L.
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Interconnecting plural devices on semiconductor substrate
438613, 438679, 427282, H01L 21285
Patent
active
057767904
ABSTRACT:
A process of Pb/Sn evaporation eliminates haloes in the manufacture of solder bump interconnects. This robust process of forms solder bump interconnects and reduces critical molebdnum mask sensitivity. Vacuum evaporation through which Pb/Sn C4 pads are deposited is performed by maintaining parallel temperature gradients between the molybdenum mask and silicon wafer, thus resulting in elimination of connecting haloes and yield losses.
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Kutt John Conrad
Starr Stephen George
Zalokar, Jr. Robert Henry
Bowers Jr. Charles L.
International Business Machines - Corporation
Radomsky Leon
Sabo William D.
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