C4-GT stand off rigid flex interposer

Details C4-GT stand off rigid flex interposer C4-GT stand off rigid flex interposer

1997-04-21

1999-03-30

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257713, 361719, 361789, H05K 720

Patent

active

058896520

ABSTRACT:
An integrated circuit package that contains an integrated circuit that is mounted to a bond portion of a substrate. The bond portion of the substrate is separated from a contact portion of the substrate by a flexible portion. The contact portion is attached to a printed circuit board by a plurality of solder joints. The flexible portion decouples the bond portion from the contact portion to allow relative movement between the package and the circuit board to minimize the strain on the solder joints. The package may also contain a spacer that separates a heat pipe from the integrated circuit and controls the thickness of a thermal grease located between the circuit and the pipe.

REFERENCES:
patent: 3626252 (1971-12-01), Cath
patent: 5311060 (1994-05-01), Rostoker
patent: 5467251 (1995-11-01), Katchmar
patent: 5532906 (1996-07-01), Hanari
patent: 5550406 (1996-08-01), McCormick
patent: 5572407 (1996-11-01), Sobhani
patent: 5586010 (1996-12-01), Mortuza
patent: 5672548 (1997-09-01), Culnane
patent: 5706171 (1998-01-01), Edwards
patent: 5744863 (1998-04-01), Culnane

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