Button rectifier package for non-planar die

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357 15, 357 52, 357 65, 357 68, 29589, H01L 2348, H01L 2934, H01L 2948

Patent

active

044980965

ABSTRACT:
An axial lead semiconductor device package is provided for use with non-planar semiconductor die. By using solders of predetermined strength, wetting and flow characteristics, melting temperature, shape, area, and thickness, reliable attachment of non-planar die to planar mounting surfaces is achieved.

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Ahn et al., "Permalloy Solder Barrier for Devices with Gold Metallization", IBM Tech. Discl. Bull., vol. 20, No. 12, p. 5317, May 1978.
Calhoun, Casowitz et al. "Structures for Protecting Schottky Barrier Diodes from Premature Breakdowns Under Reverse Voltage Conditions", IBM Technical Disclosure Bulletin, vol. 18, No. 6, Nov. 1975, pp. 1847-1848.
Rusu, Bulucea et al. "The Metal-Overlap, Laterally Diffused (MOLD) Schottky Diode", Solid State Electronics, vol. 20 (1977), pp. 499-506.

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