Butted chip array with beveled chips

Details Butted chip array with beveled chips Butted chip array with beveled chips

1996-07-22

1998-01-06

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

H05K 702

Patent

active

057061769

ABSTRACT:
In an array of butted silicon chips, as would be found in a full-page photosensitive scanner, ink-jet printhead, or LED exposure bar, individual silicon chips forming the array each define a planar bevel near the border of a neighboring chip. The planarity of the bevel avoids damage to the chips when the chips are placed in the chip array assembly.

REFERENCES:
patent: 4467342 (1984-08-01), Tower
patent: 4990462 (1991-02-01), Sliwa, Jr.
patent: 5473513 (1995-12-01), Quinn
patent: 5510273 (1996-04-01), Quinn
patent: 5545913 (1996-08-01), Quinn et al.

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