Metal fusion bonding – Process – With clamping or holding
Patent
1992-04-16
1992-12-01
Heinrich, Samuel M.
Metal fusion bonding
Process
With clamping or holding
228216, 228247, 228 57, 219 57, 219 8514, B23K 114, B23K 11087
Patent
active
051673622
ABSTRACT:
To splice two metal tapes by means of a solder wire that is thicker than the tapes themselves, their terminal edges are positioned upon one electrode, a spacing shim is inserted upon one of the tapes, another electrode is lowered onto the shim, the wire is inserted into the channel formed by the tape and shim edges and the electrodes, the shim is withdrawn to lower the upper electrode down upon the solder, and the latter is then fused.
REFERENCES:
patent: 4286744 (1981-09-01), Gullotte et al.
patent: 4563563 (1986-01-01), Ege
patent: 5098009 (1992-03-01), Tsuchida et al.
Heinrich Samuel M.
Kloften and Kloften (U.S.A.) Inc.
Volk Victor F.
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