Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1994-07-11
1996-03-19
Paumen, Gary F.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 74, H01R 2366
Patent
active
054999243
ABSTRACT:
Connector members have respective film circuits with contact bumps of male and female sets or other complementary configurations and are brought into electrical connection by butting engagement. An elastomer underlies the bumps and is compressed by the engagement to provide contact pressure. The contact bumps of each female set are three or four in number arranged to form a triangular or square ring for engagement with a single male bump to provide a self-centering action. The male contact bump can be elongate so as to bridge completely across the ring. In other examples, both complementary contact bumps are elongate and extend in transverse directions on respective film circuits so that they are brought into transverse engagement, accommodating slight misalignment. Alternatively, instead of a bump configuration, a female member is formed by an aperture in a insulating layer of one film circuit overlying a conductive path and receiving a contact bump of the other film circuit.
REFERENCES:
patent: 3526867 (1970-09-01), Keeler, II
patent: 4775917 (1988-10-01), Eichkorn
patent: 4861272 (1989-08-01), Clark
patent: 4892487 (1990-01-01), Dranchak
patent: 4911643 (1990-03-01), Perry
patent: 4976626 (1990-12-01), Dibble et al.
patent: 5118299 (1992-06-01), Burns et al.
patent: 5316486 (1994-05-01), Tanaka
patent: 5342207 (1994-08-01), Sobhani
Arisaka Hiroshi
Kawawada Kenji
Omata Kiyoshi
Kel Comporation
Paumen Gary F.
Usher Robert W. J.
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