Bussplate

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Within distinct housing spaced from panel circuit arrangement

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Details

439 92, H01R 1352

Patent

active

060073519

ABSTRACT:
A bussplate for an electronic device includes a plate having a plurality of integral electrical ground interfaces for commonizing electrical ground current within the electronic device. The plate grounds filter inserts that filter the electronic device from electronic noise and shields the electronic device from electromagnetic interference.

REFERENCES:
patent: 4208080 (1980-06-01), Teagno
patent: 4959018 (1990-09-01), Yamamoto et al.
patent: 5023752 (1991-06-01), Detter et al.
patent: 5373104 (1994-12-01), Brauer
patent: 5462444 (1995-10-01), Korsunsky et al.
patent: 5742005 (1998-04-01), Saka et al.
patent: 5744751 (1998-04-01), Kasai
patent: 5808859 (1998-09-01), Liang
patent: 5817976 (1998-10-01), Yanase et al.
patent: 5831814 (1998-11-01), Hamill
patent: 5895293 (1999-04-01), Brandberg

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