Busbar assembly with integrated cooling

Details Busbar assembly with integrated cooling Busbar assembly with integrated cooling

2011-03-29

2011-03-29

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S775000

Reexamination Certificate

active

07916480

ABSTRACT:
A busbar assembly is configured such that the power devices (e.g., IGBT die) and diodes are directly mounted to the busbars. The busbars act as heat sinks, and may be cooled using micro channels, micropin fins, direct cooling, or any other heat transfer method. One assembly includes a plurality of busbars, a plurality of power semiconductor devices bonded to the plurality of busbars, and an integrated cooling system within one or more of the busbars.

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