Bus communication system for stacked high density integrated cir

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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257685, 257686, 257690, 257692, 257777, 361729, 361772, 361790, H05K 700, H01R 900

Patent

active

054793181

ABSTRACT:
The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically connect with lead ends of adjacent integrated circuit devices. The bus system provides a path for communication from the module to external electronic devices and internal communication between the individual integrated circuit devices in the module.

REFERENCES:
patent: 3746934 (1973-07-01), Stein
patent: 4398235 (1983-08-01), Lutz et al.
patent: 4521828 (1985-06-01), Fanning
patent: 4763188 (1988-08-01), Johnson
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4884237 (1989-11-01), Mueller et al.
patent: 4953060 (1990-08-01), Lauffer et al.
patent: 4956694 (1990-09-01), Eide
patent: 5151559 (1992-09-01), Conru et al.
patent: 5221642 (1993-06-01), Burns
patent: 5270492 (1993-12-01), Fukui
patent: 5279029 (1994-01-01), Burns
patent: 5367766 (1994-11-01), Burns et al.
patent: 5394010 (1995-02-01), Tazawa et al.
Information allegedly written by Emory Garth regarding "Memory Stacks," Applicant received a facsimile from Emory Garth on Jan. 26, 1993, Applicant does not know when the information was written or its validity.
Catalog of Dense-Pac Microsystems, Inc. describing two products: DPS512X16A3 Ceramic 512K X 16 CMOS SRAM Module and DPS512X16AA3 High Speed Ceramic 512K X 16 CMOS SRAM Module, pp. 865-870 (no date provided).
"High Density Memory Packaging Technology High Speed Imaging Applications," Dean Frew, Texas Instruments Inc., SPIE vol. 1346 Ultrahigh- and High-Speed Photography, Photonics, and Velocimetry '90 pp. 200-209 (no date provided).
"Vertically-Integrated Package," Abstract, Alvin Weinberg, W. Kinzy Jones, IEEE, pp. 436-443 (no date provided).
"3D Interconnection For Ultra-Dense Multichip Modules," Abstract, Christian VAL, IEEE, pp. 540-547 (no date provided).

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