Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-05-12
1995-12-26
Ledynh, Bot L.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257685, 257686, 257690, 257692, 257777, 361729, 361772, 361790, H05K 700, H01R 900
Patent
active
054793181
ABSTRACT:
The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically connect with lead ends of adjacent integrated circuit devices. The bus system provides a path for communication from the module to external electronic devices and internal communication between the individual integrated circuit devices in the module.
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Information allegedly written by Emory Garth regarding "Memory Stacks," Applicant received a facsimile from Emory Garth on Jan. 26, 1993, Applicant does not know when the information was written or its validity.
Catalog of Dense-Pac Microsystems, Inc. describing two products: DPS512X16A3 Ceramic 512K X 16 CMOS SRAM Module and DPS512X16AA3 High Speed Ceramic 512K X 16 CMOS SRAM Module, pp. 865-870 (no date provided).
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"Vertically-Integrated Package," Abstract, Alvin Weinberg, W. Kinzy Jones, IEEE, pp. 436-443 (no date provided).
"3D Interconnection For Ultra-Dense Multichip Modules," Abstract, Christian VAL, IEEE, pp. 540-547 (no date provided).
Ledynh Bot L.
Staktek Corporation
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