Electric power conversion systems – Current conversion – With cooling means
Reexamination Certificate
1999-11-09
2001-04-10
Wong, Peter S. (Department: 2838)
Electric power conversion systems
Current conversion
With cooling means
C174S07000A, C361S637000
Reexamination Certificate
active
06215681
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the invention
The invention relates to a device to carry electric current and conduct heat. Especially devices for high electric current applications, where there is a strong need to evacuate heat generated in electronic or electric components.
2. Description of the Prior Art
In the prior art, high current conductors are shown mixed in a printed circuit board together with low signal conductors. See, for example, U.S. Pat. No. 5,223,676 (Yamamoto), U.S. Pat. No. 4,446,188 (Patel et. al).
The use of an embedded heat sink is shown in U.S. Pat. No. 4,886,571 (Butt), using a separate electric conductor to connect to a semiconductor mounted onto the heat sink.
The prior art has the apparent drawback of not providing a flexible (easily adaptable to different product requirements) current conducting system which provides adequate heat transfer from the heat generating components.
SUMMARY OF THE INVENTION
It is an object of the invention to provide a device which carries electronic and electric components, supplies them with a plurality of high current electric flows and conducts the heat generated in the components away from the components themselves, and accomplishes these tasks using a minimum of space and in a non-complicated mechanical arrangement. The manufacture of the device according to the invention is possible in existing production lines, without any alteration of the manufacturing machines.
In the invention, a basic “sandwich” structure is used, capable of efficient heat transfer and high current carrying capacity. The structure is capable of forming a power circuit with multiple current paths.
The multiple current path device, for carrying electric current to and conducting heat from an electronic circuit, according to the invention preferably has the following components:
a heat sink,
a plurality of electrically and thermally conducting substrates forming several, from each other electrically insulated, current conductors,
a thermally conductive, electrically insulating first layer, bonding each conducting substrate and the heat sink, and
a plurality of electronic or electric components electrically and thermally connected to the conducting substrates.
The device preferably further comprises a plurality of printed circuits arranged on any of the conducting substrates, each printed circuit being electrically insulated from the conducting substrate. The device further advantageously comprises a plurality of thermally conductive, electrically insulating second layers bonding the conducting substrate and the individual printed circuits. Still further, the conducting substrates may have electrically conductive vias, which conduct current between said conducting substrates and said printed circuits.
Each individual electronic or electric components is advantageously fastened on one individual conducting substrate, or may bridge two or more conducting substrates or two or more printed circuits. Alternatively, each individual electronic or electric components may be fastened to bridge one printed circuit and one conducting substrate.
The conducting substrates are preferably substantially flat and rectangular.
The device according to the invention preferably comprises two, three, four or five conducting substrates.
Each of said conducting substrates may preferably have a power connection, for connecting to a current carrier. The power connection may be a bolt means or be a protrusion of the conducting substrate itself.
The device according to the invention may preferably be a half bridge electric power circuit, a full bridge electric power circuit or a 3-phase bridge electric power circuit.
A further embodiment of the device according to the invention further comprises a substantially thermally insulating fibre-glass reinforced resin board, bonded to the thermally conductive, electrically insulating first layer with the use of an adhesive layer and is electrically connected to the plurality of electrically and thermally conducting substrates via one or more of the electronic components. The resin board preferably has one or more layers of printed circuit patterns electrically connected to the electric components.
REFERENCES:
patent: 4369485 (1983-01-01), Bell et al.
patent: 4446188 (1984-05-01), Patel et al.
patent: 4866571 (1989-09-01), Butt
patent: 5038132 (1991-08-01), Lindblom et al.
patent: 5223676 (1993-06-01), Yamamoto et al.
patent: 5837556 (1998-11-01), Ostendorf et al.
patent: 6028878 (2000-02-01), Agarwar et al.
Hellinga Richard J.
Lankin Robert G.
Schuurman Derek C.
Agile Systems Inc.
Armstrong R. Craig
Vu Bao Q.
Wong Peter S.
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