Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-06-05
2001-09-25
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C361S710000, C257S706000, C257S709000, C165S080300, C174S016300
Reexamination Certificate
active
06295201
ABSTRACT:
FIELD OF THE INVENTION
The invention relates generally to semiconductor assemblies having a power distribution plate and a heat sink. More particularly, the present invention relates to a bus bar assembly including a high current switching device powered by and embedded into a bus bar, wherein a heat sink is attached directly to the same bus bar.
BACKGROUND OF THE INVENTION
Switching assemblies having a switching device associated with a power distribution plate and a heat sink are known in the art. Generally, these switching devices are semiconductors that utilize high current transistors. Operation of a high current switching device produces a large amount of heat proportional to the respective size of the device. Furthermore, the power distribution plate or bus bar used with the high current device also carries a relatively high level of current that generates even more heat. The combined heat generated by the bus bar and switching device is sufficient to damage electrical components within the switching device. Therefore, the heat generated within the switching device and the bus bar must be drawn away by a heat sink to prevent damage to the electrical components.
High current switching devices are used in combination with high performance motors and generators, as found in automobiles and other motorized vehicles. Advancement in motor and generator technology, and more specifically the inclusion of electrical controls and computers with such devices, has compounded the need for better performing switching devices. More specifically, technological advancements now require switching assemblies to incorporate (1) a compact package, (2) a low resistance power distribution plate or bus bar, (3) low inductance of the overall switching assembly, and (4) superior heat dissipation.
One example of an advancement in generator and motor technology that requires improved switching assemblies is the Integrated Starter Alternator Damper (ISAD) device. The ISAD is a sophisticated system that replaces starters, flywheels, generators, and dampers in vehicles. The ISAD requires sophisticated switching assemblies having superior functional characteristics to provide high current and voltage for their various electromechanical components, which include electronic controls and sensors.
With these considerations in mind, the known art provides bus bars that are mechanically attached to the top of switching devices. These bus bars are usually heavy, solid metal structures that carry considerable current and generate substantial heat. The switching devices typically use high current transistors, such as Integrated Gate-type Bipolar Transistors (IGBT) or Field-effect Transistors (FET). A heat sink is attached to the switching device in order to dissipate heat produced by the bus bar and the switching device. As known in the art, heat sinks may comprise parallel copper or aluminum plates carrying a coolant gas or liquid therebetween.
Considering the power and current demands of modern applications, the known art separates the bus bar and heat sink in a manner that is either unworkable or damaging to the switching device. Thus, there is a need for a switching or bus bar assembly having a switching device, bus bar, and heat sink, wherein the bus bar and heat sink are adjacent to one another and more compact is size.
SUMMARY OF THE INVENTION
This present invention provides a bus bar assembly having a high-speed switching device, a bus bar, and a heat sink. The switching device is integrated into a cavity on the top surface of the bus bar, and the heat sink is mechanically coupled to the bottom surface of the bus bar. The bus bar may include capacitors that are positioned upside down on the top surface of the bus bar to more effectively communicate heat from the capacitor to the bus bar and then the heat sink. The heat sink may be formed from a pair of parallel plates that oppose each another to form a cooling channel, wherein a coolant, such as gas or water, may be passed through. An interior surface of one of the plates may incorporate a cooling structure such as grooves or fins.
REFERENCES:
patent: 4589057 (1986-05-01), Short
patent: 4966563 (1990-10-01), Pierce et al.
patent: 5153449 (1992-10-01), Crook et al.
patent: 5313097 (1994-05-01), Haj-Ali Ahmadi et al.
Lindsey Denis M.
Ogden Christopher
Stibgen Michael
Datskovsky Michael
Evans Steven M.
Picard Leo P.
Stratos Lightwave, Inc.
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