Bus arrangement for interconnecting circuit chips

Details Bus arrangement for interconnecting circuit chips Bus arrangement for interconnecting circuit chips

1981-12-07

1983-12-20

Edlow, Martin H.

350 9613, 350 9616, H01L 3112, G02B 514

Patent

active

044220880

ABSTRACT:
An optical bus arrangement is disclosed for interconnecting a plurality of circuit modules (15, 17 . . . ). It comprises a plurality of optical busses (25) each including a feeder waveguide (41) and a signal waveguide (43). Junctions (45) for controllably switching light from feeder to signal waveguide, and leaky regions (47) for detecting the status of the signal waveguide, are provided at regular intervals. Arrays of lasers/LEDs (33) at both ends constantly furnish light to the feeder waveguides.
Each module has a plurality of input ports (27) each comprising a photodetector for detecting light from one leaky region, and a plurality of output ports (45) each comprising an electrode grating for controlling switching of light in one junction. Input ports and output ports are integrated portions of the chips. Thus, the optical waveguide switches disclosed have the specific feature of being partially incorporated as waveguide junction in a substrate (23), and partially as control electrodes integrated on a chip.

REFERENCES:
Becker et al., "Electrooptical Switching in Thin Film Waveguides for a Computer Communication Bus", Applied Optics, vol. 18, No. 19, Oct. 1979, pp. 3296-3299.
"Introduction to Integrated Optics", Barnoski ed., Plenum Press, p. 371 (1974).
Chen et al., "Bragg Switch for Optical Channel Waveguides", Appl. Phys. Lett., vol. 33, No. 1, pp. 33-35, Jul. 1978.
Hsu et al., "Flip Chip Approach to End Fire Coupling Between Single Mode Optical Fibers & Channel Waveguides", Electronic Lett., vol. 12, No. 16, pp. 404-405, Aug. 1976.

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