Burn-in testing apparatus and method

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Details

C324S765010

Reexamination Certificate

active

07042240

ABSTRACT:
An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.

REFERENCES:
patent: 5164661 (1992-11-01), Jones
patent: 5414370 (1995-05-01), Hashinaga et al.
patent: 6191599 (2001-02-01), Stevens
patent: 6230497 (2001-05-01), Morris et al.
patent: 6362640 (2002-03-01), Wee
patent: 6477047 (2002-11-01), Markwardt et al.
patent: 6636062 (2003-10-01), Gaasch et al.

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